HTC Diamond Pcd Hard Bond Diamond Grinding Segment
The HTC Diamond PCD (Polycrystalline Diamond) Hard Bond Diamond Grinding Segment is a specialized tool used for aggressive grinding and coating removal on concrete surfaces. Here are some important features and information about this product:
Design: The HTC Diamond PCD Grinding Segment is designed with PCD chips bonded to a metal matrix. PCD is a synthetic diamond material known for its exceptional hardness and durability, making it highly effective for grinding applications.
Hard Bond: The segment features a hard bond matrix that ensures longevity and stability during the grinding process. The hard bond provides excellent resistance against wear and extends the life of the segment.
Coating Removal: These grinding segments are primarily used for removing coatings, such as epoxy, paint, adhesives, and other surface materials from concrete floors. The PCD chips aggressively grind and scrape away the coatings, allowing for efficient and thorough removal.
Compatibility: The HTC Diamond PCD Grinding Segment is designed to be used with HTC grinding machines or other compatible grinders that support HTC-style tooling. Compatibility is crucial to ensure proper fit and performance.
Application: This grinding segment is commonly used in concrete floor preparation, renovation, and coating removal projects. It is suitable for both residential and commercial applications, including warehouses, industrial facilities, garages, and more.
When using the HTC Diamond PCD Grinding Segment, it is essential to follow the manufacturer's instructions and safety guidelines. Always wear appropriate personal protective equipment, including safety glasses, gloves, and a dust mask, to protect yourself from potential hazards.
Additionally, ensure that the segment is properly installed and securely fastened to the grinding machine. It is advisable to consult the manufacturer or a professional in the field of concrete grinding for specific guidance and best practices.
Note: It's important to keep in mind that product availability and specifications may vary over time, so it's always recommended to check with us for the most up-to-date information on the HTC Diamond PCD Hard Bond Diamond Grinding Segment.
| Name | HTC Diamond Pcd Grinding Hard Bond Segment |
| Grit | 6#, 16#,18/20#, 25#, 30/40#, 50/60#, 70/80#, 100/120#, 150#, 200/220#,300#, 400# |
| Bond | Super soft, extra soft, soft, medium, hard, extra hard, super hard |
| Material | Diamond and metal powder combination |
| Segment Size | 8mm, 10mm ,12mm and 15mm thick |
| Package | Carton box for each piece or customers requirement. |
| Lead time | Regular orders 7-10 days upon payment receievd. |
| Shipping | By sea, by air and by international express, like DHL, FedEx, TNT, UPS etc. |
| Certificate | ISO9001, ISO2000, SGS Product Quality Control |
| Main Market | North America, Australia, European market. |
Features
1. Aggressive and durable
2. Use high quality diamonds and high concentration of diamonds
3. Various bonds can be made for grinding different hardness floor
4. Different segment shapes and number can be optional
Note: special logo, segment sizes and shapes, installation are available by customer's request.
More detail please contact us.
FAQ
1.Are you a manufacturer or trading company?
We are a 30 years manufacturer.
2.How to prove your quality?
We use E6 diamond,Dipea steel wire, passed ISO9001 and SGS,strict quality control and skilled workers.
3.What should I do if the products is not suitable for the market?
Giving us the detailed report first,then we analyze the reason,try to find the solutions.
If it is our problems,we will give you new products.
4.Do you provide free samples?
Small sample is welcomed.But,usually we don't provide free samples.
5.Can you provide OEM/OEM services?
It is ok.
6. Any question about HTC Diamond Pcd Hard Bond Diamond Grinding Segment, please kindly let me know! Thanks!